As part of the ongoing Future Connect Program in collaboration with the University of Sri Jayewardenepura (USJP), HUTCH hosted a group of undergraduate students for a comprehensive industry visit to its Engineering Complex (Data Centre) in Walpola, Ragama on 17th July 2025.
During the visit, undergraduates from the Faculty of Computing, USJP were given hands-on exposure to the core technical infrastructure of a leading telecom provider. They explored critical operational areas including towers, equipment and grounding systems, Data Center environmental control and access control and the functions of the Network Operations Center.
The program was designed to help students connect their academic knowledge to practical engineering processes. It also covered emerging technology topics such as 5G, IoT integration, and the support systems required to implement these innovations at scale.
The session was followed by an interactive Q&A, allowing students to engage directly with HUTCH’s engineering professionals. By continuing to invest in initiatives like Future Connect, HUTCH aims to cultivate a future-ready talent pipeline, inspire innovation among university students, and contribute meaningfully to the development of the nation’s digital economy.
