DCX Unveils Trio of High-Capacity Cooling Distribution Units
March 13, 2026
As artificial intelligence and high-performance computing workloads push rack densities to unprecedented levels, the demand for efficient and scalable liquid cooling infrastructure has become critical. In response, DCX Liquid Cooling Systems has introduced a new series of cooling distribution units (CDUs) designed to meet the diverse needs of modern data centers, from enterprise to hyperscale.
The Poland-based manufacturer this week launched three new CDU systems built on its proprietary DCX Enterprise Coolant Distribution Unit (ECDU) platform. The portfolio is engineered to cover a broad spectrum of requirements, with cooling capacities scaling from 600kW up to 2.6MW. The high-end Enterprise ECDU 1380/2600 V1 offers a capacity range of 1.38MW to 2.6MW, while the Mission Critical ECDU 1380/2600 V1H2 incorporates redundant heat exchangers and enhanced high-availability features for maximum resilience. For cost-effective and rapid deployment, the Entry ECDU 600/1200 V1 provides up to 1.2MW of cooling in a compact form factor. All models are designed to operate with coolant temperatures up to 45°C (113°F).
Maciek Szadkowski, CTO at DCX, highlighted the strategic rationale behind the launch: “In an era of rapidly escalating rack densities and the explosive growth of liquid-cooled AI deployments, we see that data center infrastructure manufacturers often offer technically outdated or limited solutions that can’t keep pace with today’s demands. With our new ECDU platform, we are redefining the industry once again – delivering superior performance, greater resiliency, and better energy efficiency than anything else on the market. Most importantly, this is the most affordable CDU portfolio available today in a standard rack or in-row form factor.”
The launch signifies DCX's continued expansion in the liquid cooling market, coming just months after the company introduced an 8MW CDU in January. By offering a graduated product line, DCX aims to provide a comprehensive solution for various liquid environments, supporting both direct-to-chip and immersion cooling architectures. This move is likely to intensify competition in the cooling sector, providing data center operators with more options to manage heat from next-generation silicon efficiently and cost-effectively.
Source: datacenterdynamics
