Intel Forges Strategic Partnership with Amkor for EMIB Production
December 1, 2025
In a strategic move to capitalize on the explosive demand for advanced semiconductor packaging driven by artificial intelligence, Intel has outsourced a portion of its Embedded Multi-die Interconnect Bridge (EMIB) production to Amkor Technology. The partnership will leverage Amkor’s facility in Incheon, South Korea, signaling a significant shift in Intel Foundry’s operational strategy to scale its packaging services more rapidly than building new domestic fabs would allow.
The global AI boom has placed unprecedented strain on the semiconductor supply chain, particularly for advanced packaging technologies essential for high-performance chips. While TSMC has long dominated this segment with its CoWoS packaging, its capacity is now heavily constrained by orders from AI industry leaders. This bottleneck has created a critical opportunity for alternative suppliers like Intel Foundry, whose EMIB and Foveros technologies are gaining substantial market interest.
According to industry reports, Intel’s decision to partner with Amkor is a direct response to this surging demand. By utilizing Amkor’s existing South Korean production lines, Intel can accelerate its time-to-market and increase overall capacity without the lead time and capital expenditure required for new facility construction. This outsourcing strategy is pivotal as EMIB is projected to be a major driver of Intel’s external foundry revenue in the near term, especially ahead of its upcoming 14A process node.
Interest in Intel’s packaging services extends across a broad spectrum of technology firms. Mainstream companies including MediaTek, Google, Qualcomm, and Tesla have reportedly expressed interest in the technology. A key factor driving this shift is the logistical and cost inefficiency of the current supply chain, where, for instance, wafers produced in the United States must be shipped to Taiwan for packaging—a process that adds significant overhead and delays. Intel’s U.S.-based packaging capabilities offer a compelling alternative, providing a more integrated and geographically diversified supply chain solution.
The implications of this partnership are substantial for the semiconductor industry. It not only positions Intel Foundry as a viable second source for critical advanced packaging but also enhances supply chain resilience for AI hardware developers. As the industry seeks to mitigate dependencies and bottlenecks, Intel’s expanded capacity through Amkor could play a crucial role in meeting the needs of next-generation AI accelerators and custom silicon.
Source: wccftech
Intel Outsources EMIB Advanced Packaging to Amkor in South Korea to Meet Surging AI Demand
