nVent Launches Enhanced Liquid Cooling Portfolio for High-Density AI Infrastructure December 24, 2025 As the demand for artificial intelligence computing surges, data center operators are grappling with the immense thermal challenges posed by next-generation AI chips. These high-performance processors, often consuming over a kilowatt of power each, are pushing traditional air-cooling systems to their limits, making advanced liquid cooling a critical infrastructure requirement for the industry's future. In response to this pressing need, nVent Electric plc has unveiled a comprehensive update to its liquid cooling product line, specifically engineered to support current and future AI workloads. The launch, announced this week, introduces a new range of modular and scalable coolant distribution units (CDUs), including both row-based and rack-based configurations. The updated portfolio also features next-generation power distribution units (PDUs) and advanced technology cooling system (TCS) manifolds. According to the company, these solutions are designed to bring cutting-edge cooling infrastructure to data centers to support the ongoing AI buildout. A key component of the launch is a new common control platform, which nVent states will enhance system reliability and improve the operational experience for data center managers. Eric Osborn, General Manager of nVent Data Solutions, emphasized the strategic importance of the development, stating, "We are tapping into our deep technical expertise, and working collaboratively with chip manufacturers and the broader ecosystem, to solve our customers’ unique challenges with these new liquid cooling and power solutions. Our commitment to leading innovation for next-generation AI chips is at the core of the work we have done in the space for more than a decade." The industry implications of this launch are significant. nVent's move reflects a broader market shift where established infrastructure providers are rapidly adapting their offerings to capture a share of the booming AI data center market. Furthermore, the company's development efforts align with open industry standards, as it is among several vendors that have built CDUs inspired by Google's open-sourced Project Deschutes design. This trend towards modular, scalable, and interoperable cooling solutions is expected to accelerate the adoption of liquid cooling, helping data centers manage power densities that are projected to reach 1MW per rack and beyond. Source: datacenterdynamics
nVent Launches Enhanced Liquid Cooling Portfolio for High-Density AI Infrastructure
