Company shows wares at Equinix’s Co-Innovation Facility
Accelsius, a two-phase liquid cooling company which is commercializing technology developed by Nokia's Bell Labs, is to deploy one of its cooling systems at an Equinix lab in Virginia.
The company recently announced that its proprietary NeuCool IR80 system will be deployed at Equinix’s Co-Innovation Facility (CIF) in the DC15 International Business Exchange (IBX) data center at the Equinix Ashburn Campus in Q3 2025.
This lab provides a platform for Equinix to work with companies that are developing new technologies, helping customers see potential solutions up close in a working environment.
“This kind of collaboration is a powerful way to demonstrate our technology in real-world scenarios,” said Josh Claman, CEO of Accelsius. “The key thing we’re finding with all the customers we’re talking to is making it tangible to them—helping them see it and visualize how it’s going to work for them. It’s one thing to talk about technology and capabilities in the abstract, but this shows it in real time.”
“Liquid cooling is revolutionizing how data centers cool powerful, high-density hardware,” said Pawel Wlodarczak, innovation director of global design & construction at Equinix. “By working with companies like Accelsius in our Co-Innovation Facility, we are able to help the industry continue to iterate and innovate on high-density cooling solutions - such a critical aspect of the data center.”
Texas-based Accelsius was founded in 2022 by Innventure to commercialize technology developed by Nokia's Bell Labs. Accelsius’ NeuCool technology had been developed for five years by Bell Labs but was not productized. No Bell Labs staff came to Accelsius.
The NeuCool system sees vaporators (also known as cold plates) mounted directly to targeted hot-spot chips. Dielectric refrigerant flows through the vaporators, where it nucleates into a vapor, which then travels to a CDU and condenses back into a liquid in a closed-loop system, then returning to the vaporator for additional cooling.
Direct-to-chip systems usually rely on water, which has a high heat capacity, but Accelsius is using a dielectric coolant, allowing it to boil in the circulating system to remove more heat.
The company has deployed technology at several data center labs, the company recently posted on LinkedIn that its NeuCool Thermal Simulation Rack is headed to London for deployment at Telehouse's new Liquid Cooling Lab.
