Thermal rack allows companies to test liquid cooling technology
Accelsius, a two-phase liquid cooling company, is deploying one of its thermal rack simulation systems at a data center in Ohio.
“We're excited to announce another deployment! This time, our Thermal Simulation Rack (TSR) has just arrived at Park Place Technologies' new facility in Cleveland, Ohio,” the company said on LinkedIn this week. “As our global ASP partner, Park Place will utilize our TSR for advanced training and real-world validation of NeuCool's superior thermal performance.”
Texas-based Accelsius was originally founded in 2022 by Innventure to commercialize technology developed by Nokia's Bell Labs that had not been productized.
Direct-to-chip systems usually rely on water, which has a high heat capacity, but Accelsius is using a dielectric coolant, allowing it to boil in the circulating system to remove more heat.
The NeuCool TSR is a thermal bank that allows companies to test and validate Accelsius' cooling solutions without the need for GPUs. Available in 30kW and 50kW configurations, it can be customized in-row up to 250kW.
The company has deployed technology at several data center labs, and recently posted on LinkedIn that its NeuCool Thermal Simulation Rack is headed to London for deployment at Telehouse's new Liquid Cooling Lab. It has also deployed a cooling system to an Equinix lab in Virginia.
Park Place Technologies provides third-party data center hardware maintenance, software technical support, infrastructure managed services, and other services. It opened a new HQ in Cleveland in July.
The company said the $90 million campus, at 747 Alpha Drive, totals 330,000 sq ft (30,658 sqm) in the main buildings. The site features a quality assurance and R&D data center hosting more than 170 operating servers, as well as a liquid cooling lab with direct-to-chip and immersion cooling technologies.
Source: DCD
