Trane and Eaton unveil integrated power and cooling reference design for AI data centers

Trane Technologies, a leading cooling and thermal management vendor, and Eaton, a power technology firm, have announced a joint effort to develop an integrated reference architecture for electrical systems and thermal management in AI data centers. The collaboration aims to address the growing complexity of designing facilities that must support the intense power and cooling demands of AI workloads.

The companies say the new reference design is the first of its kind, and that applying it to AI data center system design can deliver energy efficiency gains of 15 percent while reducing copper usage by up to 80 percent. In addition, the integrated approach is claimed to lower installation costs compared with conventional low-voltage design processes, offering a more economical path for operators scaling up digital infrastructure.

The reference design is embedded in both the Trane Continuum Rubin DSX and Eaton Beam Rubin DSX platforms, which are built to align with Nvidia's DSX platform family for AI data center construction. This alignment is intended to help operators adopt a standardized, repeatable framework for deploying AI factories at scale.

“AI and high-performance computing are transforming the demands placed on data centers, and customers want solutions that can keep pace with their needs,” said Mauro J. Atalla, senior vice president and chief technology and sustainability officer at Trane Technologies. “By combining our advanced thermal management solutions with Eaton’s innovative power management solutions, we’re delivering a coordinated design that helps customers accelerate deployment, improve efficiency and confidently plan to scale for the future.”

The combined architecture establishes a more consistent and predictable method for planning and delivering the electrical, thermal, and digital control infrastructure required for AI-driven environments. According to the companies, this simplifies setup, reduces deployment risk, and enhances overall system performance for current-generation technologies.

“We’re advancing the industry standard for speed of deployment by progressing reference designs into unified systems teams can deploy repeatedly. Aligned with the Nvidia DSX platform, we’re integrating our medium-voltage power systems and white space thermal management solutions with Trane’s advanced thermal management system architecture to help accelerate AI-factory deployment at scale,” said Michael Regelski, senior vice president and chief technology officer for the electrical sector at Eaton.

Both companies have committed to evolving the design as emerging liquid cooling technologies and direct current architectures become more mainstream in data center operations. The partnership reflects a broader industry push toward more tightly integrated infrastructure that can keep pace with the rapid evolution of AI hardware.

“AI factories demand tightly coordinated power, cooling and compute infrastructure to operate efficiently at scale. By aligning with the Nvidia Omniverse DSX blueprint, Trane Technologies and Eaton are helping customers reduce complexity and accelerate deployment of next‑generation AI data centers,” said Vladimir Troy, vice president of AI infrastructure at Nvidia. “This new integrated approach supports the robust, scalable foundations enterprises need to unlock the full potential of generative and reasoning AI and turn data into faster, smarter outcomes.”

The announcement underscores a growing trend among infrastructure vendors to offer pre-engineered, integrated systems that reduce the engineering burden on data center operators. As AI deployments continue to drive record levels of power density and cooling demand, solutions that streamline design and installation are likely to become increasingly central to the industry's expansion plans.