TSMC Resumes Production at Japanese Fab After 7.1 Magnitude Earthquake

A 7.1-magnitude earthquake struck Japan’s Kumamoto prefecture on July 28, prompting Taiwan Semiconductor Manufacturing Company (TSMC) to temporarily halt operations at its new chip fabrication facility in the region. The incident highlights the vulnerability of advanced semiconductor manufacturing to natural disasters, even in a country known for stringent seismic building codes.

The quake’s epicenter was located in Kumamoto, and the Japan Advanced Semiconductor Manufacturing (JASM) fab, situated in the town of Kikuyo, recorded a seismic intensity of upper 5 on the Japanese scale—a level strong enough to disrupt sensitive production equipment. TSMC immediately activated its emergency response protocols, evacuating all employees on site. The chipmaker confirmed that all workers were accounted for, and no injuries were reported.

According to a Reuters report citing TSMC, ongoing construction work at the facility was also unaffected by the ground motion. However, as a precautionary measure, the company suspended construction activities to ensure workers’ safety in the event of aftershocks. TSMC has since begun the process of resuming production, stating that “post-earthquake structural inspections have been completed, confirming that the structures are safe and operations are gradually resuming.” The company added that detailed inspections and impact assessments are ongoing.

The JASM fab is a cornerstone of TSMC’s global expansion strategy and a critical node in Japan’s efforts to rebuild its domestic semiconductor supply chain. Any prolonged disruption at the facility could have ripple effects across global chip supply, particularly for clients relying on advanced logic chips. The industry will be closely watching TSMC’s detailed assessment for any indication of damage to wafer processing equipment, which can be highly sensitive to vibration.